[{"data":1,"prerenderedAt":-1},["ShallowReactive",2],{"news-8f244da3-58a0-430f-9c57-af8df68a1337":3},{"id":4,"title":5,"summary":6,"original_url":7,"source_id":8,"tags":9,"published_at":23,"created_at":24,"modified_at":25,"is_published":26,"publish_type":27,"image_url":13,"view_count":28},"8f244da3-58a0-430f-9c57-af8df68a1337","高通把数据中心 HBC 架构塞进手机：2028 年商用,端侧 LLM 推理的「内存墙」破局战","高通在数据中心 AI 芯片上首次「卷」到手机赛道。6 月 27 日,高通执行副总裁杜尔加·马拉迪透露,公司本周新发布的数据中心芯片技术将在未来几年下放到智能手机,核心是那条以 3D 垂直堆叠为特征的高带宽计算(HBC)架构——把内存与计算单元紧贴在一起,绕过传统 SoC「内存外置、总线瓶颈」的老毛病。\n\nHBC 并不是新概念,AMD、SK 海力士等都在做。高通「数据中心先行、移动端回灌」,在 LLM 推理时代意义非凡:端侧大模型 7B\u002F13B 起步,KV Cache 一旦放长就触及 DRAM 带宽天花板,token 生成肉眼可见地「卡顿」;而 HBC 用 HBM 级堆叠封装把内存带宽塞进手机 SoC,理论上 token\u002Fs 拉高数倍,利好端侧 Agent、实时语音、长上下文场景。\n\n时间表上,第一代 HBC 数据中心产品明年面世,手机端商业化预期 2028 年,高通已与手机、PC、车厂同步谈判。端侧 AI 已是 iOS 27、安卓 16、鸿蒙各家重头戏,高通把 HBC 当「公开牌」打出来,本质是宣告:移动端 LLM 的瓶颈,正从「模型」转向「内存与带宽」——下半场硬件说了算。","https:\u002F\u002Fwww.jiemian.com\u002Farticle\u002F14658526.html","cfc3f7ed-9911-4f50-9532-1255a5b2d178",[10,14,17,20],{"id":11,"name":12,"slug":12,"description":13,"color":13},"fca9258a-9430-455a-b95d-b9fae5e373a8","ai-inference",null,{"id":15,"name":16,"slug":16,"description":13,"color":13},"40269b40-7942-4650-9672-ed2e6524d37a","ai-technology",{"id":18,"name":19,"slug":19,"description":13,"color":13},"e0d31e94-ce47-4c8f-831c-d3d2926d42f3","hardware",{"id":21,"name":22,"slug":22,"description":13,"color":13},"01598627-1ea6-4b27-a5d8-874971571a71","llm","2026-06-29T02:00:00Z","2026-06-28T18:08:21.431949Z","2026-06-28T18:08:21.431960Z",true,"agent",4]