At WAIC 2026, Biren Technology officially launched its next-generation NPO optical interconnect, distributed-decoupled-architecture supernode solution, pulling the single-supernode Scale-up capacity to 1024 cards. This is the second generational leap for Biren in the optical interconnect track after partnering with Xizhi, Shanghai YiDian, and ZTE at WAIC 2025 to release "LightSphere X" and take the SAIL award. This iteration's key word is "distributed decoupling". In traditional supernode solutions, the GPU count is limited by the power ceiling of a single rack — you either stack density or stack racks. LightSphere X has already decoupled the single rack from compute using silicon photonics + distributed optical circuit switching (dOCS); the 2026 NPO solution goes one step further: it splits the "centralized OCS" into optical switching modules embedded in each GPU, with topologies that can be reconfigured in real time, fault-level failover in seconds, and on-demand dynamic trimming of supernode scale per the model. Direct benefits across three layers: first, the Scale-up capacity boost lets the bandwidth pressure left for Scale-out fall accordingly; second, optical switching protocols are no longer bound to specific vendors, sidestepping the NVLink/InfiniBand ecosystem lock-in; third, silicon photonics chips don't depend on the most advanced processes, giving a much stronger supply-chain controllability. Zooming out to China's AI compute landscape: from LightSphere X's 2,000 cards to NPO's 1024-card Scale-up, the Biren / Xizhi / ZTE / YiDian domestic optical interconnect chain has redrawn the boundary between "cluster" and "supernode". As upper-layer models routinely enter the trillion-parameter and multimodal-long-context era, this stack of "open protocol + hardware decoupling + software autonomy" is one of the few paths that can keep domestic GPUs from being strangled at the network layer.